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Photograph of uniform MoS2 film with wafer sizes ranging from 2-, 4-, 8- to 12-inch. /Science Bulletin
Chinese scientists have developed a method to batch-produce a wafer-scale material, which is about one atom thin, enabling the fabrication of a record-large size of 12-inch (300 mm) wafers from that of two inches.
"We proved to the industry that this is scientifically feasible and instilled confidence," Liu Kaihui, professor at Peking University and lead scientist on the project, said in an interview with South China Morning Post.
Liu added that "if there are industrial demands in the future, progress in this field will advance by leaps and bounds."
The two-dimensional (2D) semiconductor material has become a candidate for next-generation semiconducting channel materials, with their ultra-thin thickness and pristine semiconducting properties, according to Peking University.
To balance high chip yield with low-cost manufacturing, 12-inch silicon wafers have been adopted as the standard for semiconductor manufacturing. Therefore, low-cost, large-scale batch production of wafers up to 12 inches is essential.
A screenshot of the study published in the journal Science Bulletin.
Over the past decade, scientists have produced wafer-scale films, but their sizes were limited to 2 or 4 inches and only one piece can be produced per batch.
With the new method, the team can mass-produce such materials with wafer sizes ranging from 2-, 4-, 8- to a record-large 12-inch. Besides, the wafer-scale material produced can be converted into various structures.
Relative findings were published on the journal Science Bulletin in July.
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Copyright © 2023 CGTN. 京ICP备16065310号
Disinformation report hotline: 010-85061466